TECHNICAL AND ENVIRONMENTAL PERFORMANCE OF PARTICLEBOARDS FROM Erythrina poeppigiana (Walp.) O.F. Cook IN AGROFORESTRY SYSTEMS

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Lívia Berti Sanjuan Farias
José Adolfo de Almeida Neto
https://orcid.org/0000-0002-5669-1774
Ricardo Gabriel de Almeida Mesquita
https://orcid.org/0000-0002-0513-5348
Daniel Piotto
https://orcid.org/0000-0002-6505-0098
Mara Lúcia Agostini Valle
https://orcid.org/0000-0003-2121-5281
José Bendito Guimarães Junior
https://orcid.org/0000-0002-9066-1069
Lourival Marin Mendes
https://orcid.org/0000-0001-9447-2452

Abstract

Background: This study evaluated the technical performance, energy demand, and carbon footprint of particleboards produced from Erythrina poeppigiana (Walp.) O.F. Cook wood obtained from agroforestry systems, considering different panel densities and structural configurations.


Results: Panel density significantly influenced both physical properties and environmental performance. Single-layer panels showed improved dimensional stability, with thickness swelling values below 22%, whereas multilayer panels exceeded this limit. Water absorption ranged from 40.1 to 78.4%, confirming the high hygroscopicity of the material. Mechanical performance was satisfactory, with modulus of elasticity ranging from 2062 to 2654 MPa, while modulus of rupture (18.6–23.7 MPa) and internal bond strength (0.49–0.80 MPa) showed no significant differences among treatments. In the cradle-to-gate assessment, energy demand ranged from 4649 to 4869 MJ·m⁻³ and CO₂e emissions from 189.89 to 203.06 kg CO₂e·m⁻³. Lower-density panels showed the lowest environmental impacts due to reduced wood and adhesive consumption. Adhesive production was the main contributor, accounting for approximately 72–74% of total emissions.


Conclusion: E. poeppigiana wood from agroforestry systems is a viable alternative raw material for particleboard production. Panel structure and material efficiency were the main factors controlling performance and environmental impacts. High water absorption values (40.1–78.4%) represent a critical limitation, compromising dimensional stability and restricting multilayer configurations under moisture exposure. Improvements in dimensional stability are still required.

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